Mr. Owen Jin, VP of JCET Group and General Manager of the AI & Smart Industry BU, stated: “The transition from pluggable optical modules to highly integrated CPO devices brings
As artificial intelligence and high-performance computing workloads continue to grow rapidly, system demand for optical interconnect technologies
The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider – including IC design and characterization, wafer bumping, packaging, test, and
In terms of high-density packaging and integration technology, JCET provides a number of industry-leading technologies including high-density mounting SMT capability, laser-assisted bonding (LAB),
About JCET Founded in 1972, JCET Group is the world''s leading integrated circuit manufacturing and technology services provider. JCET is a global company that serves the world through our rich
Shanghai, China, January 21 — JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer samples of its silicon photonics engine developed on
JCET is also actively promoting the mass production applications of core materials such as ceramic substrates for new energy power module packaging (DBC/DBA/AMB), aluminum wire, aluminum
In power & energy applications, JCET develops AIGC and Communication base station power modules in close partnership with leading customers. We''re expanding capacity for mid-to-high-power devices
The technology integrates optical engines with switch chips to reduce power consumption and expand bandwidth, positioning it as a core enabler for
Business Overview In 2024, JCET leveraged its core applications to strengthen customer loyalty and advance the commercialization of innovative technologies, resulting in record-high annual revenue.
Shanghai, China, January 21, 2026 — JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer
The samples have successfully completed customer validation testing. The rapid expansion of artificial intelligence and high-performance
JCET Group is a publicly traded company headquartered in Jiangyin on China''s eastern coast. It is the largest Outsourced Semiconductor Assembly and Test (OSAT) company in mainland China and
With decades of expertise in power device packaging and testing, JCET Group offers a comprehensive power product portfolio encompassing IGBT, SiC, GaN, and more. In the field of high-density power
JCET was formed in 1972, when Jiangyin converted a local factory to produce transistors. JCET went public on the Shanghai Stock Exchange in 2003 and continued to grow over time. JCET provides a
On 18 February 2025, JCET Group Co. Ltd., which is a Chinese semiconductor outsourced assembly and test company headquartered in
By integrating optical engines with ASICs in a single package, we achieve shorter optical paths, optimized thermal management, and reliable system-level performance.
Mr. Owen Jin, VP of JCET Group and General Manager of the AI & Smart Industry BU, stated: “The transition from pluggable optical modules to highly integrated CPO devices brings significant system
About JCET JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration
Does JCET Group count as an optical module JCET was formed in 1972, when Jiangyin converted a local factory to produce transistors. JCET went public on the Shanghai Stock Exchange in 2003 and
JCET CEO Li Zheng Addresses the 30th World Semiconductor Council Meeting Company News 2026-06-09 JCET Launches Next-Generation Power Module Packaging and Test Solutions for AI Data
Each module comes with unique technical requirements and demands highly specialized semiconductor packaging and testing solutions. At JCET, we bring it all together.
JCET Group: A top-tier OSAT, JCET Group provides a full suite of advanced packaging and test services, including specialized solutions for MEMS, leveraging extensive R&D in areas like
Driving the Future of Data Connectivity with Co-Packaged Optics (CPO) JCET''s latest CPO packaging solutions deliver higher bandwidth, lower power, and improved signal integrity — enabling next
JCET provides customers with a full suite of test platforms and engineering services to support a broad range of mixed signal, Radio Frequency (RF), analog, and high-performance digital semiconductor
To address this, JCET offers multiple packaging integration solutions for optical engines and flexible layout options for PICs and EICs, while supporting customers in high-speed signal
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