AOI uses optical imaging and image processing to identify defects on PCB assemblies. RGB lighting illuminates the solder joints from multiple angles, and a high-speed camera captures reflected light to generate image data. In the wave of data centers evolving towards 800G, 1. 6T, and even higher bandwidths, optical modules—as the core of network interconnects—are experiencing unprecedented increases in power consumption and thermal density. 6T, and beyond, every design decision directly impacts performance, reliability, and cost. While SMT is the default for most components, THT/through-hole soldering remains a critical enabler in optical-module PCB design thanks to unmatched mechanical. As artificial intelligence, 5G infrastructure, and hyperscale data centers demand ever-faster data transmission, optical modules have become the bedrock of modern communication. The physical interface is where even a flawless schematic typically fails in production.
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